3 Post Omniprobe® Copper Grids, Shallow downset (Box of 100)

GRD-0001.08.01-01
Omniprobe® 3 post copper TEM lift-out grids which have been designed for in-situ lift-out. These grids have been designed for optimum access and include multiple indexed mounting locations with both vertical bars and “V” shaped attachment surfaces and have a shallower downset than other grids. 3mm diameter.
¥ 19,982

Quantity Discounts

Buy 5-9 items (¥ 16,985 each)
Buy 10+ items (¥ 14,986 each)
In Stock 26

Description

Omniprobe® 3 post CU TEM lift-out grids specifically designed for in-situ lift-out. These grids include multiple indexed mounting locations with both vertical bar and V shaped attachment surfaces. The Omniprobe® grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts. 

These grids have a shallower downset and slightly wider center post than GRD-0001.01.01. Other features include:
  • They come packaged in glass vials.
  • Thickness (nominal) : 30 μm

Technical Specifications:

Posts Material Thickness (Nominal)
Microns
Nominal Post
Downset Microns
Unique Feature
3 Copper 30 10
3 Molybdenum 30 10 Top Downset Only
0 Berylium 25 N/A Half Ring
5 Copper 40 10 5th Post is "E"
4 Copper 30 10
4 Molybdenum 30 10 Top DS Only
3 Copper 30 5 Side Access
3 Copper 30 5
5 Copper 35 5 5th Post is "E"
4 Copper 30 5

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